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Bumping Technology
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![[Eng Sub] Wafer Bumping Process: Solder bump, Cu pillar bump, UBM](https://i.ytimg.com/vi/VLwqssWjRMU/hqdefault.jpg)
![[Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP](https://i.ytimg.com/vi/Yr_1vcYdbvI/hqdefault.jpg)
